背腔刻蚀型横向激励薄膜体声波谐振器制备技术研究
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1.中国电子科技集团公司第二十六研究所,重庆 400060 ;2.国知创芯(重庆)科技有限公司,重庆 401332 ;3.中电科芯片技术(集团)有限公司,重庆 401332

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徐阳(1981-),男,四川省南充市人,高级工程师。

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The Study of Based on Back Cavity Etching and Lateral Exciting Film Bulk Acoustic Resonator
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1.The 26th Institute of China Electronics Technology Group Corporation, Chongqing 400060 , China ;2.NIICAS (Chongqing) Technology Co., Ltd, Chongqing 401332 , China ;3.Academy of Chips Technology, China Electronics Technology Group, Chongqing 401332 , China

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    摘要:

    随着移动通信技术的快速发展,薄膜体声波滤波器逐渐向高频和大带宽方向发展。该文研究了POI(LiNbO3/SiO2/Si)基片上背腔刻蚀型横向激励薄膜体声波谐振器制作工艺,通过研究POI基IDT光刻、背腔硅刻蚀等工艺,确定了IDT层曝光量和背腔刻蚀等关键工艺参数。研制出的背腔刻蚀型横向激励薄膜体声波谐振器,其谐振频率为4 565 MHz,反谐振频率为5 035 MHz,机电耦合系数为20.86%。此制备工艺对研究高频、大带宽薄膜体声波滤波器具有重要的参考意义。

    Abstract:

    With rapid development in mobile technology, film bulk acoustic resonators have developed in a highfrequency and wide bandwidth direction.This study focuses on the technological process of back cavity etching and alateral exciting film bulk acoustic resonator on the POI (LiNbO3/SiO2/Si).On the study of the IDT optical lithography,etching and back cavity corrosion, the critical process parameters are determined.The frequency response curveshows that resonance and antiresonance frequencies were 4 565 and 5 035 MHz, respectively.The effective electromechanicalcoupling coefficient was 20.86%, which is significant for research on high frequency and wide bandwidthfilm bulk acoustic resonators.

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徐阳,司美菊,吴高米,刘文怡,巩乐乐,甄静怡,余奇,陈金琳.背腔刻蚀型横向激励薄膜体声波谐振器制备技术研究[J].压电与声光,2024,46(3):296-299. XU Yang, SI Meiju, WU Gaomi, LIU Wenyi, GONG Lele, ZHEN Jingyi, YU Qi, CHEN Jinlin. The Study of Based on Back Cavity Etching and Lateral Exciting Film Bulk Acoustic Resonator[J]. PIEZOELECTRICS AND ACOUSTOOPTICS

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  • 收稿日期:2024-04-07
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  • 在线发布日期: 2024-06-25
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