A metal lift off process suitable for LiTaO3 and LiNbO3 substrates have been introduced in this paper. It relies on formation of an inhibition layer at the top of the resist film by a simple treatment with an aqueous alkaline solution is introduced. This metal lift off technique doesn′t need additional equipments, and can provide a good method of fabricating SAW chip with resolution of less than o.5 μm. This proposed technique has the features of good stability and low cost.