溅射功率对Mg2Si薄膜制备的影响
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湖北省教育厅科学技术研究计划基金资助项目;湖北省恩施州第一批农业与社会发展科技指导性基金资助项目

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Effects of Sputtering Power on the Fabrication of Mg2Si Films
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    摘要:

    采用射频磁控溅射系统,在Si(111)衬底上制备了不同溅射功率下的Mg2Si薄膜。通过X线衍射(XRD)和冷场发射电子显微镜 镜(FESEM)对Mg2Si薄膜的晶体结构和表面形貌进行了表征,理论分析了Mg2Si薄膜在Si(111)衬底上的外延生长关系,得到了Mg2Si薄膜的外延生长特性。研究结果表明,在80~110 W的溅射功率范围内,Mg2Si薄膜具有Mg2Si(220)的外延择优生长特性,并且随着溅射功率的增加Mg2Si(220)衍射峰先增强后变弱,在100 W功率下Mg2Si(220)衍射峰最强。

    Abstract:

    The epitaxial films of Mg2Si on Si(111) substrate were prepared with different sputtering power by RF magnetron sputtering system. The crystal structures and the surface morphology of the Mg2Si films were characterized by X ray diffraction (XRD) and the field emission scanning electron microscope (FESEM). The epitaxial growth characteristics of Mg2Si films on Si(111) substrates are obtained by theoretical analysis. The results show that, with increasing sputtering power from 80 W to 110 W, the Mg2Si films have one preferential growth feature of Mg2Si(220) and with increasing the sputtering power the intensity of the diffraction peak of Mg2Si film increase firstly, then decreases. The diffraction peak intensity of Mg2Si film was up to the strongest when the sputtering power was 100 W.

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张昌华,余志强.溅射功率对Mg2Si薄膜制备的影响[J].压电与声光,2012,34(2):273-275. ZHANG Changhua, YU Zhiqiang. Effects of Sputtering Power on the Fabrication of Mg2Si Films[J]. PIEZOELECTRICS AND ACOUSTOOPTICS

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  • 在线发布日期: 2012-09-29
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