A kind of microelectronic packaging materials were prepared by traditional solid state reaction method. The thermal,mechanic and electric properties were measured and the phase and microstructure evolution of the materials were characterized by XRD and SEM.The effect of BaO content on the properties of materials has been studied.The results showed that BaO didn’t influence the main phase of quartz so much,but it could promote the formation of BaO·Al2O3·2SiO2 and inhibit the precipitation of the cristobalite phase. Increasing the content of BaO could improve the dielectric properties of materials to a certain extent.However,the glass network would be gradually destroyed,affecting the mechanical and thermal properties and resulting in the bending strength reduction as well as the thermal expansion coefficient decrease.