MEMS电热驱动器的设计与分析
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国家“八六三”基金资助项目(2015AA042701)

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Design and Analysis of MEMS ElectroThermal Driver
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    摘要:

    该文介绍了一种双层膜的电热微驱动器。根据高等数学和材料力学可求得偏置层结构末端的位移公式,进而验证了采用镍作为偏置层材料的合理性。利用CoventorWare软件对驱动器进行有限元仿真,得出偏置层在温度为300 K、电压为5 V、响应时间为5 ms时,偏置层厚度H1与驱动器位移d的曲线关系图,驱动层厚度H2与d的曲线关系图以及驱动层厚度与驱动器左侧固定端应力的曲线图,从而确定H2=8 μm。通过验证驱动器的最大应力为130 MPa,小于镍的许用应力,确定驱动器在H2=8 μm可以进行可靠的工作。分析驱动层厚度和偏置层厚度的加工误差对驱动器末端位移的影响,可得在对偏置层进行加工时要严格控制H1的加工误差。对驱动器进行了模态分析和抗过载分析,电热驱动器的工作频率范围在821.011 Hz以内,且具有抗击8 000 g(g=10 m/s2)冲击加速度的能力。

    Abstract:

    A micro electrothermal driver with double layer films has been introduced in this paper. The displacement formula of the bias layer end has been derived, and the rationality of using the nickel as the bias layer has been verified. The finite element simulation of the driver has been carried out by using the CoventorWare. The curve of the bias layer thickness H1 to the driver displacement d, the curve of the driving layer thickness H2 to the driver placement d, and the curve of the driving layer thickness to the stress of the left fixed end of the driver have been obtained at the temperature of 300 K, voltge of 5 V and the response time of 5 ms, thus H2=8 μm has been obtained. The maximum stress of driver is 130 MPa, which is less than the allowable stress of nickel, thus the driver can operate reliably at H2=8 μm. The influence of the machining errors of the driving layer and bias layer thickness on the driver end displacement are analyzed, and it concludes that the machining error of the bias layer thickness(H1) must be strictly controlled during machining. The modal analysis and the antioverload analysis of the driver have been carried out. It has been found that the operating freqiency of the electrothermal driver is 821.011 Hz and has the ability to resist the acceleration of 8 000 g(g=10 m/s2).

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邓炬锋,史春景,郝永平,刘双杰. MEMS电热驱动器的设计与分析[J].压电与声光,2016,38(3):475-478. DENG Jufeng, SHI Chunjing, HAO Yongping, LIU Shuangjie. Design and Analysis of MEMS ElectroThermal Driver[J]. PIEZOELECTRICS AND ACOUSTOOPTICS

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  • 在线发布日期: 2016-05-31
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