It is very difficult for micromachining high hardness of ceramic materials. In order to solve this problem, the use of the gold film as the intermediate layer in SiPZT (siliconlead zirconate titanate) eutectic bonding process and the alignment dicing PZT, a bulk PZT microstructure is fabricated. The experimental results show that the eutectic bonding strength of SiPZT can reach over 20 MPa when the gold film is 1 μm in thickness. The strength provides a reliable base for PZT material micromachining. The method of SiPZT eutectic bonding and the PZT alignment dicing had good processing capacity for superhard materials such as PZT in the micro machining fields. It provides a new way for micromachining of PZT microstructures array.