锗单晶在酸性SiO2抛光液条件下的抛光机理及加工工艺
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杲星(1990-),男,山东省泰安市人,工程师,硕士,主要从事多种晶体加工工艺的研究。

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Polishing Mechanism and Processing Technology of Germanium Single Crystal Under Acidic SiO2 Polishing Solution
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    摘要:

    该文研究了化学机械抛光(CMP)条件下,锗单晶在含HNO3的SiO2抛光液中的腐蚀过程。通过改变抛光时间,分析锗单晶表面状态的变化规律。结果表明,在SiO2抛光液pH值为1~2时,SiO2抛光液中存在 Si—OH和 Si—O-形式;锗单晶先与HNO3反应生成Ge(NO3)4,而后Ge4+的含氧酸盐会剧烈水解生成Ge—OH,Ge—OH 继续反应并以Ge—OH2+形式存在。由于表面电荷的吸引,Si—O-和Ge—OH2+在锗单晶表面生成Si—O—Ge软化层,从动力学角度加快了腐蚀速率,促进了表面抛光的程度。抛光时间为15~20 min时,机械抛光和侵蚀的法向速度处于平衡状态,CMP抛光后锗单晶表面粗糙度Sa≤0.8 nm,10倍显微镜下无划痕、麻点。

    Abstract:

    The corrosion process of germanium single crystal in SiO2 polishing solution containing HNO3 and under the condition of chemical mechanical polishing(CMP) was studied. By changing the polishing time, the changing law of the surface state of germanium single crystal was analyzed. The results show that when the pH value of SiO2 polishing solution is 1~2, there are the forms of Si—OH and Si—O- in SiO2 polishing solution; germanium single crystal reacts with nitric acid to form Ge(NO3)4. Then, the oxygenate of Ge4+ will be violently hydrolyzed to generate Ge—OH, and Ge—OH will continue to react in the form of Ge—OH2+. Under the attraction of surface charge, Si—O- and Ge—OH2+ create Si—O—Ge softening layer on the surface of germanium single crystal, which speeds up the corrosion rate and promotes the degree of surface polishing from the perspective of kinetics. When the polishing time is controlled within 15~20 min, the normal velocity of mechanical polishing and erosion is in equilibrium. After CMP polishing, the surface roughness Sa of germanium single crystal is ≤ 0.8 nm, and there are no scratches and pits under 10x microscope.

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杲星,顾跃,夏卫东,董鸿林,甘禹,徐扬,丁雨憧.锗单晶在酸性SiO2抛光液条件下的抛光机理及加工工艺[J].压电与声光,2022,44(3):467-470. GAO Xing, GU Yue, XIA Weidong, DONG Honglin, GAN Yu, XU Yang, DING Yuchong. Polishing Mechanism and Processing Technology of Germanium Single Crystal Under Acidic SiO2 Polishing Solution[J]. PIEZOELECTRICS AND ACOUSTOOPTICS

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  • 在线发布日期: 2021-11-23
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