Achieving secondary parallel sealing and meeting airtightness standards have become key to repairing airtight products. To solve this issue, this paper introduces a process method applied to secondary parallel seal welding. By laser uncapping the hermetically sealed components after parallel seal welding and controlling the generation of wast ematerial, the surface of the shell enclosure is milled flat using machining. Finally, the secondary parallel seal is welded. The airtight-component system integration packaging (SIP) module is tested and analyzed to detect leaks after the secondary parallel seal welding. The leakage rate of less than 1.01×10^-8 Pa·m³/s for the fine-leakage detection meets the requirements of electronic and electrical component test methods (GJB.360B-2009).There is no continuous bubble generation for rough leakage detection. Therefore, the process introduced in this paper can provide an effective solution for secondary parallel sealing airtight components with controllable waste material.