As a passive, small-sized, and high-power-tolerant device, the film bulk acoustic resonator (FBAR)has been widely used in radio frequency signal processing.Wafer-level hermetic packaging represents miniaturizedpackaging and plays a critical role in various high-reliability applications.Both gold-gold and gold-tin bonding arewidely used in FBAR hermetic wafer-level packaging.However, gold-tin bonding has a more straight forward implementationprocess.Therefore, this study investigates the application of gold-tin bonding in hermetic wafer-levelpackaging.Under the condition of ensuring bonding strength, 3 GHz filter samples were produced.The experimentalresults demonstrated identical perfomances with all samples passing the reliability tests