MEMS高温压力传感器耐高温引线结构优化
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作者单位:

中北大学 微纳器件与系统教育部重点实验室,山西 太原 030051

作者简介:

刘润鹏(1995-),男,山西省忻州市人,硕士生。通信作者:雷程(1987-),男,山西省长治市人,高级实验师,博士。

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基金项目:

国家重点研发计划( 2023YFB3209100);山西省重点研发计划项目(202102030201001、202102030201009)

伦理声明:



Optimization of High-Temperature-Resistant Lead Structure for MEMS High-Temperature Pressure Sensors
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Affiliation:

Key Laboratory of Micro/Nano Devices and Systems, Ministry of Education, North University of China, Taiyuan 030051 , China

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    摘要:

    绝缘体上硅(SOI)高温压力传感器可在高温(高于125 ℃)下工作。通常情况下构成惠斯通电桥的电阻单独处于压力敏感区,以提高其灵敏度,但在其工作期间压力传感器器件区电阻重掺区与金属引线连接处存在一定高度差,在加压加电高温环境下此处热应力变大,金属引线因过热而出现金属引线断裂或失效,无法满足高温需求。在此基础上研究了一种硅引线技术,使其与压敏电阻处于同一高度层,金属引线平铺在硅引线上端,经退火后形成良好的欧姆接触。实验测试表明,该方案能使压力传感器在300 ℃高温环境下正常工作,金属引线与电阻区连接完好,传感器敏感区应力降低接近50%,且优化后传感器灵敏度符合设计要求。

    Abstract:

    Silicon-on-insulator high-temperature pressure sensors can operate at temperatures above 125 °C due

    to their unique properties.Generally, the resistance forming the Wheatstone bridge is located solely in the pressuresensitive

    region to enhance its sensitivity.However, during its operation, a certain height difference exists between

    the resistance of the heavily doped region of the pressure sensor device and its connection with the metal lead.The

    thermal stress in this area increases under high-temperature conditions during pressurization and electrification.Metal

    leads cannot meet the high-temperature requirements and may break or fail due to overheating.Therefore, this

    study investigated a silicon lead technology that had the same layer height as a varistor.A metal lead was laid flat on

    this silicon lead, and the end was annealed to form a robust ohmic contact.Experimental testing demonstrated that

    this method could ensure the normal operation of the pressure sensor in a high-temperature environment of 300 °C.

    The metal lead was well connected to the resistance zone.The stress in the sensitive area of the sensor was reduced

    by nearly 50%, and the optimized sensor sensitivity met the design requirements

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引用本文

刘润鹏,雷程,梁庭,杜康乐. MEMS高温压力传感器耐高温引线结构优化[J].压电与声光,2024,46(3):386-391. LIU Runpeng, LEI Cheng, LIANG Ting, DU Kangl. Optimization of High-Temperature-Resistant Lead Structure for MEMS High-Temperature Pressure Sensors[J]. PIEZOELECTRICS AND ACOUSTOOPTICS

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  • 收稿日期:2024-02-23
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  • 在线发布日期: 2024-06-25
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