The performance of small-volume surface acoustic wave (SAW) filters is significantly affected bypackaging. To solve this problem, a new SAW trapezoidal filter circuit topology is proposed. By analyzing the phenomenonof the upturn of the remote rejection caused by the packaging of the filter at high frequency, the layout designis changed from the circuit structure to realize the on-chip inductance. The circuit topology that combines theconventional trapezoidal filter structure with the special grounding structure of the longitudinally coupled dual-moderesonator type filter (DMS) contributes to out-of-band rejection and design flexibility. The optimal topology of thehigh-order RF SAW filter with a center frequency of 2 580 MHz, bandwidth of 50 MHz, and an insertion loss ofless than 2.5 dB is obtained via simulation analysis on a standard 42°Y-X lithium tantalate (LiTaO3) substrate.