In the process of developing the Chinese national standard “Micro-electromechanical systems technology-Bend testing methods of thin film materials”, cantilever beam structures with different sizes were designed andprepared to verify the accuracy and practicality of the method used. Their bending deformation processes were recordedby nanoindentation instrumentation, and the deformation-stress curves of the structures were obtained. Thebending mechanical properties of thin-film materials can be effectively characterized based on this standard, and themeasured data from the bending tests were analyzed. The experimental results show that the repeatability over 10tests reached 0.32% using this testing method, and the same type of test structure exhbits strong regularity. Thetest point near the anchor of the cantilever beam exhibits high deformation stiffness, fully consistent with the theoreticalprediction. Therefore, the bending test method used in this paper has good repeatability and can be used fortesting the bending mechanical properties of thin-film materials.