Currently, surface acoustic wave filters urgently require high-quality lithium tantalate piezoelectricsingle crystal composite film substrates to improve performance. After ion implantation, wafer warpage and particleincrease can easily occur, leading to defects such as irregular stripes and bonding voids during the subsequent bondingprocess, which seriously hinder the preparation of high-quality lithium tantalate piezoelectric single crystal compositefilms. The internal stress, damage, and particle changes caused by ion implantation were analyzed and characterizedusing X-ray diffraction (XRD), focused ion beam-transmission electron microscopy (FIB-TEM), particletester, and other equipment. The reasons for the increase in warpage and particles were explained, and appropriatesolutions were proposed. Finally, the implanted wafer was successfully prepared with low warpage and fewer particles.Further verification of the bonding process revealed that high-quality bonded wafers without defects such asstripes and voids can be obtained, laying the foundation for the efficient preparation of lithium tantalate piezoelectricsingle crystal composite films