The paper presents a tin-plating solution to remove gold using a carrier board for ceramic packaged SAW filters. Batch mounting of filters can be achieved using a tin-plating carrier board with external expansion sold er pads. Meanwhile, reflow is performed on the heating table to dissolve the gold layer of the filter pad. After re moving the tin-plating filter, the solder on the surface of the pads is suctioned off using a vacuum tin gun to remove the gold. A detailed introduction to the solder-pad design of the carrier board is provided herein. The abovemen tioned operation is monitored using an infrared thermometer. After gold removal, the device is analyzed based on the pad surface and solder joint interface. Subsequently, verification via an environmental test is performed to con firm that the gold plating layer on the solder pad surface is completely removed and that the device demonstrates high reliability. The results provide a reference for the design of the gold-removal process for ceramic sealed de vices.